Adhesive pad having EMC shielding characteristics（美国EMC技术专利）

sysop

  <div class="content"><p><b>Abstract</b><br />The present invention is directed to the present invention is directed to an adhesive pad with electromagnetic compatibility (EMC) characteristics&#46; An adhesive pad suitable for bonding electrical components may include a thermal bonding adhesive material and a lattice interlayer&#46; The adhesive material is suitable for being disposed between the first electrical component and the second component, the thermal bonding adhesive bonding the first electrical component to the second component&#46; The lattice interlayer is included within said thermal bonding adhesive material, the lattice interlayer having electromagnetic capability (EMC) shielding characteristics&#46;</p><p><a href="http://www&#46;google&#46;com/patents/pdf/Adhesive_pad_having_EMC_shielding_charac&#46;pdf?id=olUOAAAAEBAJ&output=pdf&sig=_4o7xA2xSFdVMDFS-nqjT6AS0E8"><font color="#336699">Adhesive pad having EMC shielding characteristics（美国EMC技术专利）</font></a></p></div>